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Alumina laminated substrate/package (HTCC)
Due to the layered structure, free wiring routing is possible. Additionally, CAVTY structure is also possible, allowing for complex configurations.
Package composed of high thermal conductivity AlN material.
Due to its layered structure, free wiring routing is possible. Additionally, cavity structures can be implemented to accommodate complex designs. It is a package made of high thermal conductivity AlN material that allows for the dissipation of heat when high-heat-generating chips are mounted.
